As the proliferation of digital devices and services risks to outpace our ability to protect our goods from attackers, Chip-to-Cloud Security Forum provides an independent conference platform dedicated to advance end-to-end digital security.
60+ security experts from both Academia and Industry will share original ideas, groundbreaking results, new techniques, new methodologies, new collaboration opportunities… with 300 high-level participants.
Here is a sample of the challenges to be addressed this year:
Highlights of the 2014 edition:
Four main themes: Embedded Security Technologies, Trusted Mobile Devices & Services, M2M & IoT Security, Cloud Security.
End-to-end IT security goes Cloud: the Forum will dedicate a large portion of its security expertise to create trust in the Cloud. From TPM or HSM in the Cloud to the latest advances of "strong authentication" architectures, a full 2.5-day stream of 5 sessions. Note also the FIDO Alliance workshop to close the Forum.
Special track with the US NIST: "Intersection of Cloud & Mobility". Eminent experts from US and EU governments, academia and industry will give a balanced view of mobile Cloud Computing issues: security, interoperability, federation…
NFC security remains a hot topic, in particular the latest developments of HCE: a half-day session shared with NFC World Congress.
M2M & IoT security: the tremendous challenges of connecting billion “things” will be addressed during a half-day session shared with M2M Innovation World Congress.
Embedded devices security: latest attacks paths and state-of-the-art countermeasure techniques will be presented and discussed
Synergies within World Smart Week:
The Forum fully benefits from the complementary parallel conferences:
– NFC World Congress: note the joint session on NFC security
– M2M Innovation World Congress: note the joint session on M2M security
– World e-ID Congress features strong synergies around biometrics and authentication technologies
– Note also the Smart Solution Show: a 2.5-days exhibition from Sept. 22 to 24.
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